采用基片曲率法测量并研究了Ag/Cu薄膜的应力与温度的关系.初始应力为-250MPa压应力,退火后为370 MPa拉应力.采用基于形变机制图的模型模拟了应力与温度关系的实验曲线,结果表明,温度和应力不同,在薄膜内起作用的主要形变机制也不同可能的形变机制包括位错滑移、幂律蠕变以及扩散蠕变机制.薄膜比块体材料的应变速率低,在同样的应力下应变更加困难.在退火过程中,薄膜内先使应力松弛的是Ag,将Ag各蠕变机制中的激活能提高到块体材料的1.25～1.35倍,模拟曲线与实验曲线符合得很好.
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