模拟计算了半导体材料CdZnTe布里奇曼法单晶体生长过程,分析了熔体的过热温度、坩埚侧面强化换热以及坩埚加速旋转(ACRT)等因素对结晶界面的形态和晶体组分偏析的影响.结果表明:当熔体的过热温度减小时,熔体中自然对流的强度显著降低,固液界面的凹陷深度有所增加,晶体的轴向等浓度区显著加长,而晶体组分的径向偏析明显增大.坩埚的侧面强化换热增加了自然对流强度,也增大了固液界面的凹陷,但是对溶质成分的偏析影响较小.坩埚加速旋转引起的强迫对流强度远大于自然对流,显著增大了固液界面的凹陷,使熔体中的溶质分布成为均一的浓度场,显著减小了晶体组分的径向偏析,增加了晶体组分的轴向偏析.
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