以铜和铌作为中间夹层,真空扩散焊接Ti(C,N)/Ni,研究温度和时间等主要工艺参数对Ti(C,N)/Ni界面微观组织和性能的影响.结果表明,当扩散焊接的温度低于1273 K时,界面的夹层材料基本保持不变,界面的微观组织为Cu/Nb层状物,铜在镍中有少量扩散;而当扩散焊接的温度为1523K时,界面微观组织在初期为Ni8Nb的金属问化合物+离散析出的CuNi固溶体,到后期变为靠近Ti(C,N)侧为(Ti,Nb)(C,N)+NbT(Ni,Ti,Cu)6+NbNia层,靠近Ni侧为NiCu+NbNis层.这表明,液态Cu为过渡液相,通过Ni的溶解而形成CuNi过渡液相,加速了Nb在CuNi过渡液相中的溶解.由此产生的NiNbCu过渡液相能浸润Ti(C,N),并在界面处形成少量的(Ti,Nb)(C,N)固溶体合金,从而提高了界面的结合性能,界面剪切强度可达到140 MPa.
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