对于用射频磁控溅射技术在Si基片上制备的Bi:YIG系薄膜,用快速循环退火方法对其进行晶化处理,研究了退火温度对Bi:YIG薄膜结晶状态和形貌的影响,以及退火气氛和循环周期对薄膜性能的影响.结果表明,用快速循环退火可以在si单晶基片上得到磁性能优良的薄膜(饱和磁化强度139 kA/m,矫顽力6.37 kA/m)并使薄膜形貌有较大改善,在石英基片上制备的薄膜法拉第角比常规退火的薄膜增大了约一倍.
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