从锈层中分离出黄色细菌,经分子生物学技术鉴定为海藻希瓦氏(Shewanella algae,SA)菌.采用分光光度法研究了其生长曲线的变化,发现该细菌的生长分为3个阶段:指数生长阶段、稳定阶段和衰亡阶段.采用电化学交流阻抗技术、扫描电镜和荧光显微技术等方法研究了SA菌对Zn-Al-Cd牺牲阳极材料腐蚀行为的影响.结果表明,含SA菌培养基的试样的开路电位要高于无菌培养基中试样的电位,电荷传递电阻Rct值大于无菌培养基的Rct值,说明该SA菌能够抑制试样的腐蚀.分析原因是细菌在试样表面形成生物膜,隔离了腐蚀介质与试样的接触,同时,细菌的生长消耗了氧气,抑制了腐蚀的发生;试样在含SA体系中,5d时,其表面覆盖比较致密的生物膜;而在不含细菌的体系中,试样表面有明显的腐蚀坑;试样在含SA体系中7d时,生成比较完整的生物膜,随着体系中营养物质及氧气的减少,SA菌逐渐减少,11d后试样表面附着的SA菌所剩不多.
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