在不同塑性应变幅下对[233]共面双滑移取向Cu单晶体进行疲劳实验直至循环饱和,然后在不同温度进行退火处理.利用SEM-ECC和TEM观察疲劳位错结构及其退火后微观结构的变化,结果表明,退火温度为300℃时,位错结构均发生了明显的回复,高应变幅下疲劳样品中甚至出现了部分再结晶.在500和800℃退火,所有晶体都发生了严重的再结晶,并且有大量的退火孪晶出现.随着塑性应变幅和累积塑性应变量的增加,应变集中程度明显增加,为再结晶的发生和孪晶的萌生提供了更大的局部应变能,所以再结晶发生得更为显著,退火孪晶变得更为粗大且数量增加,退火孪晶的形成与层错的出现有密切关系.DSC测试分析表明,再结晶的发生不是突发式的,而是一个缓慢的过程.
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