通过粉末包埋渗法并经过真空均匀化热处理制备高比表面积的泡沫NiCrAl电热合金,考察了真空均匀化热处理温度对泡沫NiCrAl电热合金中金属元素蒸发的影响,采用SEM和XRD等分析手段,研究了泡沫NiCrAl的成分、结构及其与电阻率的关系.研究结果表明,以泡沫NiCr为基材通过调整渗Al温度及适当的真空均匀化热处理,能获得成分均匀、具有高表观电阻率的泡沫NiCr(20-30)Al(3-9)电热合金.泡沫NiCr渗Al后形成Ni固溶体,Cr,Ni2Al3,NiAl和Ni3Al的多相结构,随着Al含量的增加电阻率降低.经过真空均匀化热处理后,当Al含量很低时,Al固溶在Ni固溶体中,电阻率比泡沫NiCr高且随Al含量增加而上升；当Al质量分数达到约5％时,表观电阻率达最大值；当Al含量更高时,除Ni固溶体外还有NiaAl相生成,电阻率又开始降低；Al和Cr含量均较高时,未溶解的Cr沉淀相会显著降低泡沫NiCrAl的电阻率,故泡沫NiCr30Al9不适宜用作电热合金.
参考文献
| [1] | Cooksona E J,Floyda D E,Shih A J.Int J Mech Sci,2006; 48:1314 |
| [2] | Amori K E,Laibi H A.Energy,2011; 36:4524 |
| [3] | Walther G,Kl5den B,Biittner T,Weissg(o)rber T,Kieback T,B(o)hm A,Naumann D,Saberi S,Timberg L.Adv Eng Mater,2008; 10:803 |
| [4] | Hodge A M,Dunand D C.Intermetallics,2001; 9:581 |
| [5] | Choe H,Dunand D C.Acta Mater,2004; 52:1283 |
| [6] | Liu P S,Fu C,Li T F,Yu Q,Lii M.Acta Metall Sin,1999;35:509(刘培生,付超,李铁藩,于青,吕明.金属学报,1999; 35:509) |
| [7] | Langlois S,Coeuret F.J Appl Electrochem,1989; 19:43 |
| [8] | Gibson L J,Ashaby M F.Cellular Solid:Structure and Properties.2nd Ed,Cambridge:Cambridge University Press,1997:6 |
| [9] | Huang P Y.The Principle of Powder Metallurgy.2rd Ed,Beijing:Metallurgical Industry Press,1997:20(黄培云.粉末冶金原理.第二版,北京:冶金工业出版社,1997:20) |
| [10] | Wang X,Yu J L.J Exp Mech,2001; 16:438(王曦,虞吉林.实验力学,2001:16:438) |
| [11] | Goussery V,Bienwenu Y,Forest S,Gourgues A F,Colin C,Bartout J D.Adv Eng Mater,2004; 6:432 |
| [12] | Kenesei P,Kadar C,Rajkovits Z,Lendvai J.Ser Mater,2004; 50:295 |
| [13] | Michailidis N,Stergioudi F,Omar H,Tsipas D N.Adv Eng Mater,2008; 10:1122 |
| [14] | Zhang Y L,Duan D L,Zhao Y H,Li S.J Aeronaut Mater,2011; 31(suppl):255(张月来,段德莉,赵宇航,李曙.航空材料学报,2011:31(增刊):255) |
| [15] | Duan D L.PhD Dissertation,Graduate University of Chinese Academy of Sciences,Beijing,2006(段德莉.中国科学院研究生院博士学位论文,北京,2006) |
| [16] | Goward G W,Boone D H,Giggins C S.ASM Trans Quart,1967; 60:228 |
| [17] | Goward G W.J Met,1970; 22:31 |
| [18] | Goward G W,Boone D H.Oxid Met,1971; 3:475 |
| [19] | Lin C C,Tu D,Shen P,Gan D.Chin J Mater Sci,1984;16A:74 |
| [20] | Tu D C,Seigle L L.Thin Solid Films,1982; 95:47 |
| [21] | Huang H L,Chen Y Z,Gan D.Mater Sci Eng,2002; A328:238 |
| [22] | Huang H L,Gan D.Mater Sci Eng,2008; A485:550 |
| [23] | Chien A,Gan D,Shen P.Mater Sci Eng,1996; A206:215 |
| [24] | Raghavan V.J Phase Equilib Diff,2010; 31:381 |
| [25] | Huang W,Chang Y A.Intermetallics,1999; 7:863 |
| [26] | Dupin N,Ansara I,Sundman B.Calphad,2001; 25:279 |
| [27] | Kaufman L,Nesor H.Metall Mater Trans,1974; 5B:1623 |
| [28] | Bao E,Tian S J.Vacuum Heat Treatment.Shenyang:Liaoning Science and Technology Press,2009:25(包耳,田绍洁.真空热处理.沈阳:辽宁科学技术出版社,2009:25) |
| [29] | Tian S.The Physical Properties of Materials.Beijing:Beihang University Press,2004:37(田莳.材料物理性能.北京:北京航空航天大学出版社,2004:37) |
| [30] | Merchant S M,Notis M R.Mater Sci Eng,1984; 66:47 |
| [31] | Oforka N C,Haworth G W.Scand J Metall,1987; 16:184 |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%