借助显微硬度测试、电导率测试、浸泡腐蚀实验、SEM,TEM和元素面扫描,研究了T6和T78时效工艺对Al-0.75Mg-0.75Si-0.8Cu(质量分数,％)合金显微结构和性能的影响.结果表明,实验合金在T6峰值时效(180℃,8 h)时,硬度为128.3 HV,电导率为27.3×106 S/m.在T6(180℃,5 h)基础上,分别进行温度为195,205和215℃的二级时效,即T78时效工艺,随二级时效时间的延长,合金硬度总体变化趋势为先降低后升高,而电导率值逐渐增大；最佳T78工艺为(180℃,5 h)+(195℃,2 h),此时合金的硬度最高,为129.2 HV,电导率为27.6×106 S/m.TEM观察发现,T6峰值时效时,晶粒内主要析出针状的β″相,经T78双级时效处理后,晶粒内析出大量的板条状析出相,而晶界无析出带仅稍有变化.T78工艺能在保持力学性能的同时,大幅提高耐晶间腐蚀性能,其原因是晶粒内形成了表面有Cu富集的板条状析出相.晶粒内析出大量板条状强化相,使得合金硬度与T6峰值相当,同时Cu偏聚在析出相与Al基体界面处,促使更多Al基体中的Cu析出,基体与无析出带(PFZ)电位差大大降低,使得其抗晶间腐蚀性能大大提高.
参考文献
| [1] | Chen J H,Liu C H.Trans Nonferrous Met Soc China,2011; 21:2352(陈江华,刘春辉.中国有色金属学报,2011:21:2352) |
| [2] | Chen J H,Costan E,Van Huis M A,Xu Q,Zandbergen H W.Science,2006; 312:416 |
| [3] | Guinier A.Nature,1938; 142:570 |
| [4] | Tian N,Zhao G,Zuo L,Liu C M.Acta Metall Sin,2010;46:613(田妮,赵刚,左良,刘春明.金属学报,2010; 46:613) |
| [5] | Liu Y N,Chen J H,Yin M J,Liu C H,Wu C L,Zhao X Q.J Chin Electron Microsc Soc,2010; 29:280(刘亚妮,陈江华,尹美杰,刘春辉,伍翠兰,赵新奇.电子显微学报,2010; 29:280) |
| [6] | Zhan H,Mol J M C,Hannour F,Zhuang L,Terryn H.Mater Corros,2008; 59:670 |
| [7] | Larsen M H,Walmsley J C,Lunder O T,Nisancioglu K.Mater Sci Forum,2006; 519:667 |
| [8] | Dif R,Bes B,Warner T,Lequeu P,Ribes H,Lassinccp P.Advances in the Metallurgy of Aluminum Alloys.Ohio:AMS International Publications,2001:390 |
| [9] | Williams J C,Starke E A.Acta Mater,2003; 51:5775 |
| [10] | Tanaka M,Warner T.Mater Sci Forum,2000; 331:983 |
| [11] | Shi A,Shaw B A,Sikora E.Corros Sci Sect,2005; 61:534 |
| [12] | Sinyavskii V S,Ulanova V V,Kalinin V D.Prot Met,2004;40:537 |
| [13] | Liao Y F,Chen J H,Liu C H,Li X L,Feng J N.J Chin Electron Microsc Soc,2012; 31:116(廖元飞,陈江华,刘春辉,李祥亮,冯佳妮.电子显微学报,2012;31:116) |
| [14] | Vukmirovic M B,Dimitrov N,Sieradzk K.J Electrochem Soc,2002; 149:B428 |
| [15] | Svenningsen G,Larsen M H,Walmsley J C,Nordlien J H,Nisancioglu K.Corros Sci,2006; 48:1528 |
| [16] | Li H,Pan D Z,Wang Z X,Zheng Z Q.Acta Metall Sin,2010; 46:494(李海,潘道召,王芝秀,郑子樵.金属学报,2010; 46:494) |
| [17] | Zandbergen H W,Andersen S J,Jansen J.Science,1997;277:1221 |
| [18] | Marioara C D,Andersen S J,Stene T N,Hasting H,Walmsley J C,Van Heelvort A T J,Holmestad R.Philos Mag,2007; 87:3385 |
| [19] | Chakrabarti D J,Laughlin D E.Prog Mater Sci,2004; 49:389 |
| [20] | Torsmter M,Lefebvre W,Marioara C D,Andersen S J,Walmsley J C,Holmestad R.Scr Mater,2011; 64:817 |
| [21] | Arnberg L,Aurivillius B.Acta Chem Scand Ser A,1980;34:1 |
| [22] | Wang X,Esmaeili S,Lloyd D J.Metall Mater Trans,2006;37A:2691 |
| [23] | Hasting H S,Walmsley J C,Van Helvoort A T J,Marioara C D,Andersen S J,Holmestad R.Philos Mag Lett,2006;86:589 |
| [24] | Van Huis M A,Chen J H,Zandbergen H W,Sluiter M H F.Acta Mater,2006; 54:2945 |
| [25] | Esmaeili S,Vaumousse D,Zandbergen M W,Poole W J,Cerezo A,Lloyd D J.Philos Mag,2007; 87:3797 |
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