利用元胞自动机(cellular automaton,CA)方法,建立了模拟枝晶和显微气孔的二维数值模型.该模型基于凝固过程中显微气孔的形成机理,考虑了枝晶和气孔的形核与生长、溶质和H的再分配与扩散、界面曲率效应等因素.模拟结果可描述气孔与枝晶组织的耦合竞争生长、以及溶质和H的微观偏析.应用该模型对Al-7％Si(质量分数)合金在凝固过程中显微气孔的形成进行了模拟研究,分析了初始H含量和冷却速率对显微气孔形成的影响,将模拟结果与实验结果进行了比较.结果表明:随初始H含量增加,气孔体积分数增大,气孔形核和开始生长所需要的时间缩短.随冷却速率降低,气孔体积分数和最大半径均增大,气孔在较高的温度下开始形核和生长.气孔之间以及气孔和枝晶之间存在竞争生长.
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