研究了150℃等温时效过程中无Pb焊料Sn3.0Ag0.5Cu与Cu基体间金属间化合物(intermetallic compound,IMC)的生长速率及形貌演化,以及IMC的生长演化对焊锡接点力学性能的影响.结果表明,IMC厚度与等温时效时间的平方根呈线性增长关系,随着等温时效时间的增加,IMC与焊料界面由初始的凹凸不平的扇贝状形貌逐渐变得平坦.IMC厚度和界面粗糙度共同影响焊锡接点的拉伸强度和断裂模式,随着时效时间的增加,IMC变厚,同时焊料与IMC界面变平坦,断裂模式由焊料内部的韧性断裂逐渐转变为IMC层内部的脆性断裂.
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