Cu-Nb复合线材在形变与退火过程中显微结构演变的研究

金属学报, 2014, 50(2): 231-237. doi: 10.3724/SP.J.1037.2013.00622

Cu-Nb复合线材在形变与退火过程中显微结构演变的研究

邓丽萍 ^1, , 杨晓芳 ^2, , HAN Ke ^3, , 孙泽元 ^4, , 刘庆 ^5,

1.重庆大学材料科学与工程学院,重庆400044;National High Magnetic Field Laboratory, Tallahassee, Florida, USA, 32310

2.重庆大学材料科学与工程学院,重庆,400044

3.National High Magnetic Field Laboratory, Tallahassee, Florida, USA, 32310

4.重庆大学材料科学与工程学院,重庆,400044

5.重庆大学材料科学与工程学院,重庆,400044

基金项目: National Natural Science Foundation of China(.51031002 and 51201188) State Key Laboratory For Advanced Metals and Materials(2010ZD-02) Natural Science Foundation Project of Chongqing Science and Technology Commission(2010BB4074) 国家自然科学基金项目51031002和51201188,中丹纳米金属合作项目NSFC-DNRF 51261130091,重庆市自然科学基金项目2010BB4074,先进金属及材料国家重点实验室项目2010ZD-02及美国国家科学基金合作项目DMR-0084173资助 National Science Foundation of United States(DMR-0084173) Danish National Research Foundation and National Natural Science Foundation of China(NSFC-DNRF 51261130091)

关键词： Cu-Nb复合线材 , 界面密度 , 层错 , 尺度效应

STUDY ON THE MICROSTRUCTURE EVOLUTION OF Cu-Nb COMPOSITE WIRES DURING DEFORMATION AND ANNEALING

Keywords： Cu-Nb composite wire , interface density , stacking fault , size effect

采用SEM和TEM,对不同形变量及退火温度下的Cu-Nb微观复合线材的显微组织结构进行了分析,并对形变和退火试样进行了硬度测试.结果表明:随着形变量增大,材料界面密度及其增加速率逐渐增大.当材料结构达到纳米尺寸时(应变=24.8),界面密度及其增加速率显著增加,使得硬度及其增加速率明显增大,同时伴随有纳米Cu基体内部层错和旋转晶界的产生.退火过程中Cu基体的显微组织变化表现出明显的多尺度效应,其变化可分为3个阶段:微米及亚微米Cu基体先发生回复再结晶,而纳米Cu基体回复再结晶受到抑制;纳米Cu基体回复再结晶;Nb丝球化及长大.

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