采用流延成型工艺制备了(Na0.85K0.15)0.5Bi0.5TiO3无铅压电陶瓷, 研究了陶瓷退火前后的显微组织结构, 结果表明陶瓷主晶相为钙钛矿相结构, 并伴随有形貌呈针状的第二相K2Ti6O13出现; 陶瓷断面和表面的晶粒形貌有差别, 采用退火处理无法消除第二相K2Ti6O13,但可有效改善陶瓷断面的晶粒形貌, 同时增大材料的矫顽场, 并使剩余极化强度(Pr)、压电常数(d33)、介电常数(ε)与介电损耗(tanδ)变小. (Na0.85K0.15)0.5Bi0.5TiO3无铅压电陶瓷的电滞回线表现出明显铁电体的特征, 其矫顽场为2680V/mm, Pr达36.6μC/cm2, d33达113pC/N, Kp为0.27, Qm达154.
(Na0.85K0.15)0.5Bi0.5TiO3lead-free piezoelectric ceramics were prepared by tape casting process. The effects of heat-treatment on the microstructure and piezoelectric properties of ceramics were investigated. The results show that the ceramics with densified microstructure can be prepared by tape casting process.
The microstructure of cross section is not the same dense as that of surface. There are two phases coexist in the ceramics: perovskite phase and K2Ti6O13 phase whose appearance is whisker shape. It is difficult to eliminate K2Ti6O13 by heat-treatment process. But heat-treatment will improve the microstructure of cross section effectively and decrease piezoelectric constant d33, dielectric constant and ε dielectric loss tanδ . (Na0.85K0.15)0.5Bi0.5TiO3(lead-free piezoelectric ceramics show obvious characteristic of ferroelectrics with coercive electric field Ec 2680V/mm and remnant polarization Pr 36.6μC/cm2, d33, Kp and Qm of ceramics are 113pC/N, 0.27 and 154 respectively.
参考文献
| [1] | 电子信息材料咨询研究组. 电子信息材料咨询报告. 北京: 电子工业出版社, 2000. [2] 黎辉东, 冯楚德, 向平华(LI Hui-Dong, et al). 无机材料学报(Journal of Inorganic Materials), 2004, 19 (3): 579--585. [3] Hosono Y, Harada K, Yamashita Y. Ferroelectrics, 1999, 229: 273--278. [4] 初宝进, 李国荣, 江向平, 等(CHU Bao-Jin, et al). 无机材料学报(Journal of Inorganic Materials), 2000, 15 (5): 815--821. [5] 王天宝, 高 敏, 王列娥, 等(WANG Tian-Bao,et al). 无机材料学报(Journal of Inorganic Materials), 1987, 2 (3): 223--231. [6] Andreas Roosen. Ceramic Transactions, 1999, 97: 103--121. [7] 戚玉敏, 崔春翔, 申玉田, 等(QI Yu-Min,et al). 硅酸盐学报(Journal of the Chinese Ceramic Society), 2004, 32 (6): 743--746. [8] 黄继芬, 金作美. 盐湖研究, 1994, 2 (1): 67--73. [9] 胡恒瑶, 古宏晨, 程存康, 等. 中国有色金属学报, 2004, 14 (1): 363--368. [10] Li G L, Wan G H, Hong J M. Materials Research Bulletin, 1999, 34: 2341--2349. |
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