欢迎登录材料期刊网

材料期刊网

高级检索

采用极化曲线及交流阻抗技术研究了不同浓度的苯基硫脲(稳定剂)对6063铝合金表面镍层的电化学性能的影响.极化曲线结果表明,镀液中加入苯基硫脲后的镀镍层比基体铝合金具有更正的腐蚀电位(Ecorr)、小孔(点)腐蚀电位(Epit)及更低的腐蚀电流(icorr).为了解释镍层的电化学性能,建立了等效电路模型,并拟合出了表面电阻(Rcoat)及电容(Qcoat),电荷转移电阻(Rct)及双电层电容(Qdl)等腐蚀参数.交流阻抗研究结果表明,加入6 ~ 10 mg/L苯基硫脲后的镀镍层具有较高的表面电阻(Rcoat)、电荷转移电阻(Rct)及较低的表面电容与双电层电容(Qcoat与Qdl).镀镍层的交流阻抗谱及极化曲线的测试结果表明,制备的镀层具有较好的耐腐蚀性能,并且相互吻合.采用扫描电子显微镜及能谱对化学镀镍层的表面形貌及成份进行了分析.结果显示,表面处于较均匀的状态,磷元素的质量分数超过10%.

参考文献

[1] Pardo A,Merino M C,Arrabal R,et al.Enhanced Corrosion Resistance of A3xx.x/SiCp Composites in Chloride Media by La Surface Treatments[J].Electrochim Acta,2006,51:4367-4378.
[2] Danilidis I,Hunter J,Scamans G M,et al.Effects of Inorganic Additions on the Performance of Manganese-based Conversion Treatments[J].Corros Sci,2007,49:1559-1569.
[3] SHAN Chuanli,HUANG Xinmin,WU Yucheng,et al.Effect of Cu Content in Electroless Ni-Cu-P Coatings on Their Microstructure and Properties[J].Chinese J Appl Chem,2008,25 (10):1161-1165 (in Chinese).单传丽,黄新民,吴玉程,等.Cu含量对Ni-Cu-P化学镀层组织结构和性能影响[J].应用化学,2008,25(10):1161-1165.
[4] Bolger P T,Szlag D C.Current and Emerging Technologies for Extending the Lifetime of Electroless Nickel Plating Baths[J].Clean Prod Processes,2001,2:209-219.
[5] Baskaran I,Sankara Narayanan T S N,Stephen A.Effect of Accelerators and Stabilizers on the Formation and Characteristics of Electroless Ni-P Deposits[J].Mater Chem Phys,2006,99:117-126.
[6] Lee Jae-Young,Horiuchi Shin.Electroless Nickel Plating on Patterned Catalytic Surfaces by Electron Beam Lithography[J].Thin Solid Films,2007,515:7798-7804.
[7] Petukhov I V.The Effect of Component Concentrations in Electroless Nickel Plating Solution on Topography and Microrelief of Ni-P Coatings[J].Russ J Electrochem,2008,44:147-157.
[8] Yu H C,Chen B Z,Wu H Y,et al.Improved Electrochemical Performance of Trivalent-chrome Coating on Al 6063 Alloy via Urea and Thiourea Addition[J].Electrochim Acta,2008,54:720-726.
[9] Tzeng G S.Effect of Halide Ions on Electroless Nickel Plating[J].J Appl Electrochem,1996,26:969-975.
[10] El-Egamy S S.Corrosion and Corrosion Inhibition of Cu 20%Fe Alloy in Sodium Chloride Solution[J].Corros Sci,2008,50:928-937.
[11] Cheng X L,Ma H Y,Chen S H,et al.Corrosion of Stainless Steels in Acid Solutions with Organic Sulfur-containing Compounds[J].Corros Sci,1999,41:321-333.
[12] Divakara Shetty S,Shetty P,Sudhaker Nayak H V.The Inhibition Action of N-(furfuryl)-N'-phenyl Thiourea on the Corrosion of Mild Steel in Hydrochloric Acid Medium[J].Mater Lett,2007,61:2347-2349.
[13] XIE Bin,LAI Chuan,XIANG Yanggumg,et al.Crystal Structure,Thermal Stability and Corrosion Inhibition of N,N-Diethylammonium O,O'-Di (4-methylphenyl) Dithiophosphate[J].Chinese J Appl Chem,2012,29 (2):200-208 (in Chinese).谢斌,赖川,相阳光,等.O,O'-二(4-甲苯基)二硫代磷酸-N,N-二乙铵的晶体结构、热稳定性及缓蚀性[J].应用化学,2012,29(2):200-208.
[14] Palomino L E M,Suegam P H,Aoki I V,et al.Investigation of the Corrosion Behaviour of a Bilayer Cerium-silane Pre-treatment on Al 2024-T3 in 0.1 M NaCl[J].Electrochim Acta,2007,52 (27):7496-7505.
[15] CAO Chunan,ZHANG Jianqing.An Introduction to Electrochemical Impedance Spectroscopy[M].Beijing:Chinese Sciences Press,2002:36-46(in Chinese).曹楚南,张鉴清.电化学阻抗谱导论[M].北京:科学出版社,2002:36-46.
[16] Teófilo R F,Ceragioli H J,Peterlevitz A C,et al.Improvement of the Electrochemical Properties of "As-grown" Borondoped Polycrystalline Diamond Electrodes Deposited on Tungsten Wires Using Ethanol[J].J Solid State Electrochem,2007,11:1449-1457.
[17] LI Songmei,DU Juan,LIU Jianhua,et al.Corrosion Behavior of Steel A3 Influenced by Thiobacillus Thiooxidans[J].Acta Phys-Chim Sin,2009,25(11):2191-2198(in Chinese).李松梅,杜娟,刘建华,等.A3钢在氧化硫硫杆菌作用下的腐蚀行为[J].物理化学学报,2009,25(11):2191-2198.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%