利用羧基丁苯胶乳优良的成膜性能,并通过氯化钯掺杂使薄膜具备催化化学镀的活性,在其表面进行化学镀铜研究,选用次亚磷酸钠和硼氢化钠为还原剂,将硫酸铜还原成单质铜.采用扫描电子显微镜(SEM)、能量色散谱(EDS)和X射线衍射(XRD)等对其形貌、成分进行表征.测试了胶膜的增重率、表面金属及沉积层的结合牢度.结果表明,薄膜的表面形成均匀致密、导电性优良和结合力良好的铜层.该方法可应用于平面非金属材料如聚酯透明材料、装饰板材等,获得了良好导电表面,形成具有电磁屏蔽功能的面型材,具有广阔应用前景.
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