介绍了W/Ti合金扩散阻挡层在集成电路布线技术中的作用及应用情况. 阐述了W/Ti合金靶材的特性参数-相对密度、微观结构、金属纯度, 与W/Ti合金薄膜性能之间的关系, 指出高密度、高纯度、富Ti相含量少的合金靶材是制备优良W/Ti合金扩散阻挡层薄膜的基本条件. 介绍了制备W/Ti合金靶材的3种方法-真空热压、惰性气体热压、热等静压, 并概述了不同方法制备的靶材性能上的差异, 给出制备高性能W/Ti合金靶材的工艺条件.
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