随着45 nm技术的临近,减小单个晶体管尺寸以提高晶体管集成度的方法逐渐达到物理极限.传统掺杂多晶硅/二氧化硅栅结构因硼杂质扩散穿透、多晶硅耗尽和电子隧穿等效应使深亚微米器件的性能退化.此外,沟道载流子迁移率退化也阻碍Si基MOS性能的提升.因此,需采用高k介质、金属栅和应变硅等新材料、新技术以改善Si基MOS管性能.本文在介绍这3种新材料优势的同时,分析了适合未来平面式硅基CMOS技术中的高介电常数材料和金属栅材料的种类,指出了未来电路中新材料的进一步发展方向.
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