利用差示扫描量热法(DSC)研究了2139铝合金在时效过程中的相变行为和析出序列,并测试了合金不同状态下的硬度及电导率,利用透射电镜(TEM)研究了合金的微观组织特征.结果表明:2139合金在时效过程中,随着温度的升高,DSC曲线上出现3个放热峰,其峰值温度分别为171,230和276℃,分别对应着合金中的3个析出过程,即Cu原子的偏聚形成GP,Ω相在{111}<,Al>面上的析出和θ/θ相在{001}<,Al>的析出过程.合金的时效析出序列为:α<,sss>→GPzone,Mg-Ag cluster→Ω相→θ'相→θ相.在时效初期,由于固溶原子脱溶而降低了晶格畸变程度,从而使得电导率略有降低,而后随着时效温度的升高,析出相的数量和种类也越来越多,电导率逐渐升高;合金的硬度随着时效温度的升高而升高,但当温度达到330℃时,由于析出相发生粗化和长大而导致硬度降低.
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