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利用TaCl2-H2-HCl反应体系,采用冷壁式化学气相沉积法(CVD)在钼基体表面沉积钽涂层.通过X射线衍射仪、金像显微镜及扫描电镜等手段,对不同沉积温度下钽涂层的组成、组织及形貌进行了研究.结果表明:在1000~1300℃范围内,钽沉积层的相组成无变化,而对择优生长有一定影响;钽沉积层晶粒尺寸随沉积温度的升高而增大;钽沉积层表面颗粒呈金字塔形多面体且随沉积温度的升高而增大.

参考文献

[1] 《稀有金属手册》编辑委员会.稀有金属手册[M].北京:冶金工业出版社,1995:433.
[2] 刘世友 .钽在高新技术中的应用[J].稀有金属与硬质合金,1998,133(06):55.
[3] S. M. CARDONNE;P. KUMAR;C. A. MICHALUK .Tantalum and its Alloys[J].International Journal of Refractory Metals & Hard Materials,1995(4):187-194.
[4] Rowe C E .The use of tantalum in the process of industry[J].JOM-Journal of the Minerals Metals and Materials Society,1999,51(04):29.
[5] R. W. Buckman Jr. .New applications for tantalum and tantalum alloys[J].JOM,2000(3):40-41.
[6] 吴全兴.钽及其合金的用途[J].稀有金属快报,2002(3):23-24.
[7] Ensinger W .Ion beam sputter coating of tantalum tube inner walls for protection against hydrogen embrittlement[J].Surface and Coatings Technology,1996,84(01):434.
[8] Taxil P.;Savall A. .Tantalum Protective Thin Coating Techniques for the Chemical Process Industry: Molten Salts Electrocoating as a New Alternative[J].International Journal of Refractory Metals & Hard Materials,1996(5/6):365-381.
[9] Laurila T;Zeng K;Liang M H;Kivilahti J K Molarius J Riekkinen T Suni Ⅱ .Tantalum carbide and nitride diffusion barriers for Cu metallization[J].Microelectronic Engineering,2002,60(01):71.
[10] J.-P.Delplanque;W.D.Cal;R.H.Rangel .Spray atomization and deposition of tantalum alloys[J].Acta materialia,1997(12):5233-5243.
[11] Wolf H.;Schulz SE.;Gessner T.;Streiter R. .GROWTH RATE MODELING FOR SELECTIVE TUNGSTEN LPCVD[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,1995(1/4):332-338.
[12] Maxwell J;Boman M;Williams K .High-speed laser chemical vapor deposition of amorphous carbon fibers[J].Micromachining and Microfabrication Process Technology,1999,20(09):227.
[13] 孟广耀.化学气相淀积与无机新材料[M].北京:科学出版社,1984:3.
[14] Korotkov RY;Ricou P;Farran AJE .Preferred orientations in polycrystalline SnO2 films grown by atmospheric pressure chemical vapor deposition[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2006(1/2):79-87.
[15] 上海市机械制造工艺研究所.金相分析技术[M].上海:上海科学技术文献出版社,1987:792.
[16] 蔡宏中,胡昌义,陈力,王云.金属有机化合物化学气相沉积法制备铱薄膜的研究[J].稀有金属,2009(02):200-204.
[17] 王恩哥.薄膜生长中的表面动力学(Ⅰ)[J].物理学进展,2003(01):1-61.
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