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为保证ECL具有更好的电路性能,低温下制备SiGe HBT作为基本器件的SiGe ECL电路更适于低温应用,且传输延迟时间更小.

参考文献

[1] J D Cressler;E F Crabbe;J H Comfort et al.On the profile design and optimization of epitaxial Si-and SiGe-base bipolar technology for 77K applications-parts II:circuit performance issues[J].IEEE Transactions on Electron Devices,1993,40(03):542-555.
[2] Katsuyoshi Washio;Eiji Ohue;Katsuya Oda;Masamichi Tanabe;Hiromi Shimamoto;Takahiro Onai;Masao .A selective-epitaxial-growth SiGe-base HBT with SMI electrodes featuring 9.3-ps ECL-gate delay[J].IEEE Transactions on Electron Devices,1999(7):1411-1416.
[3] C A King;J L Hoyt;J F Gibbons .Bandgap and transport properties of Si1-xGex by analysis of nearly ideal Si/Si1-xGex/Si heterojunction bipolar transistors[J].IEEE Transactions on Electron Devices,1989,36(10):2093-2104.
[4] D Behammer;J N Albers;U Konig et al.Si/SiGe HBTs for application in low power ICs[J].Solid-State Electronics,1996,39(04):471-480.
[5] E Kasper;H Kibbel;H J Herzog et al.Growth of 100GHz SiGe-heterobipolar transistor(HBT)structures.part 1[J].Japanese Journal of Applied Physics Part 2,1994,33:2415-2418.
[6] M C Jeske;R C Jaeger .BILOW-Simnlation of low-temperature bipolar device behavior[J].IEEE Transactions on Electron Devices,1989,36(08):1475-1488.
[7] 孔德义 .超高频SGe基区异质结双极晶体管的理论研究和优化设计[D].东南大学,1999.
[8] 刘百勇;陈斗南.ECL集成电路-原理与设计[M].北京:国防工业出版社,1983
[9] J M C Stork.Bipolar transistor scaling for minimum switching delay and energy dissipation[J].IEEE IEDM Technical Digest,1988:550-553.
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