将YBa2Cu3O7-δ微粉与有机胶混合均匀,涂在单晶MgO基片上采用不同热处理工艺制备了YBa2Cu3O7-δ(YBCO)涂层,XRD和SEM分析发现无规取向的粉末在热处理后出现很强的c轴取向,经低温(940℃)热处理后涂层由a-b面取向随机的颗粒状晶粒组成,高温处理(1050℃)后涂层由片状晶粒组成,不同测量电流的R-T结果表明两种工艺涂层具有弱连接特点.
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