综述了化学镀镍溶液中的稳定剂及其作用,重点讨论了稳定剂的分类及其作用机理.在吸附理论的基础上对稳定剂的吸附能力作了详细探讨,并对其影响因素进行了简要分析.同时介绍了描述稳定剂吸附的几个模型,并指出稳定剂的研发是今后镀液稳定性得以提高的关键.
参考文献
| [1] | 姜晓霞.化学镀镍理论与实践[M].北京:科学出版社,2000 |
| [2] | 胡文彬;刘磊;仵亚婷.难镀基材化学镀镍技术[M].北京:化学工业出版社,2003 |
| [3] | AnsonFC;黄慰曾.电化学和电分析化学[M].北京:北京大学出版社,1983 |
| [4] | PayneR .Free Energy of adsorption of some organic addicives as a function of the molar free energy of dissolution[J].Chemical Interfacial Electrochem,1973,41(06) |
| [5] | 张祖训;汪尔康.电化学原理和方法[M].北京:科学出版社,1999 |
| [6] | MalloryGO;Hajdu J B.Electroless Plating:Fundamentals and Applications[M].Florida,USA:American Electroplaters and Surface Finishers Soc,1990 |
| [7] | AndersonMA;Rubin Alan J.Adsorption of inorganics at solid-liquid interfaces[M].Michigan,USA:Ann Arbor Science Publishers Inc,1981 |
| [8] | GasserRPH;赵壁英;吴念祖.金属的化学吸附和催化作用导论[M].北京:北京大学出版社,1991 |
| [9] | ParfittGD;Rochester C H.Adsorption from solution at the solid/liquid Interface[M].New York:Academic Press,1983 |
| [10] | DuongDDo.Adsorption analysis:equilibria and kinetics[M].London:Imperial College Press,1998 |
| [11] | NicholsonD;Parsonage N G.Computer simulation and the statistical mechanics of adsorption[M].New York:Academic Press Inc,1982 |
| [12] | 吴辉煌.电极学原理[M].厦门:厦门大学出版社,1991 |
| [13] | 段世铎;谭逸玲.界面化学[M].北京:高等教育出版社,1990 |
| [14] | Yin X.;Hong L.;Chen BH.;Ko TM. .Modeling the stability of electroless plating bath - diffusion of nickel colloidal particles from the plating frontier[J].Journal of Colloid and Interface Science,2003(1):89-96. |
| [15] | WILLIAMJ;Hunt;Charles F Zukoski .Cosistent surface potentials from bulk suspension properties[J].Journal of Colloid and Interface Science,1977,195(08):32-41. |
| [16] | ZhangS;Bates J De .Stabilizer concentration and local environment:their effect on electroless nickel plating of PCB micropads[J].Journal of the Electrochemical Society,1999,146(08):2870-2875. |
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