通过对SiC/C层状复合材料烧结工艺的系统研究,得出该材料在烧结助剂质量分数为2% Al2O3、6% Y2O3,烧结温度1 900℃,保温1 h,加压30 MPa的烧结工艺较为合理.复合材料较块体SiC断裂韧度提高了74.5%,其断裂方式呈现出"假塑性",层状复合陶瓷的增韧机制主要是由于弱夹层的存在引起裂纹偏转、分支、止住而吸收能量.
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