采用非均相沉淀包裹法制得铜包SiC复合粉体,利用热压烧结工艺制备了含有体积分数为20%～65%SiC颗粒的SiCp/Cu复合材料.用X射线衍射仪、扫描电镜、能谱分析等测试方法对试样进行了成分和微观形貌分析.结果表明:包裹法制得的SiCp/Cu复合材料中基体铜形成连续的结构,SiC分散较均匀;随着SiC含量的增加,试样孔隙率提高,抗弯强度下降;而硬度则先增后降,并在SiC体积分数为35%时出现最大值;所有试样均表现为脆性断裂.
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