本文采用提拉法生长出了硅酸镥闪烁晶体,讨论了晶体生长中遇到的问题,所生长的硅酸镥晶体有开裂、解理、多晶、回熔现象等宏观生长缺陷和包裹物、位错等微观缺陷.开裂是由热应力和晶体解理两种因素引起的,其中热应力是导致开裂的主要因素,优化生长工艺条件可完全避免开裂.晶体中存在两种包裹物,成份分别为氧化镥和坩埚材料铱,氧化镥很可能是未参加反应的原料,也有可能是氧化硅挥发而导致氧化镥析出.
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