用电子探针方法分析了在不同组织的碳钢基体上电沉积Ni-P合金的初期沉积行为.结果表明,Ni-P合金在渗碳体基体表面和晶界上优先沉积,沉积初期的镀层分布是不均匀的.消除镀层初期不均匀分布的有效途径是对基体组织进行均匀化处理.
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