利用纯金板作阳极,不锈钢板作阴极,配位体Y为电解液,在阳离子膜电解槽中电解制备无氰水溶性金溶液,探索了该工艺各种参数和反应条件.研究结果表明,电化学合成该溶液的最佳条件为:阳极电解液Y浓度1~3mol/L,阴极电解液Y浓度0.1~1.0mol/L,槽电压 15~20V,温度30℃~40℃,电解时间3h;实验所得的无氰水溶性金溶液质量浓度为1.26g/L,电流效率可达到5%.
参考文献
[1] | D. -M. Tsai;B. -T. Lin .Defect detection of gold-plated surfaces on PCBs using entropy measures[J].The International Journal of Advanced Manufacturing Technology,2002(6):420-428. |
[2] | Shindo .Gold plating solution and gold plating method using thereof[P].US 6511589,2003-01-28. |
[3] | Kitada .Gold plating solution and plating process[P].US 6565732,2003-05-20. |
[4] | Graham Williams .The Cyanides of Gold[J].Gold Bulletin,2004,37(06):56-59. |
[5] | Kadota .Electrolytic gold plating method and apparatus therefore[P].US 6746579,2004-06-08. |
[6] | R.Martens;M. Pecht .Effects and interactions of design parameters for gold-plated electric contacts[J].Journal of Materials Science. Materials in Electronics,2000(3):209-218. |
[7] | Abys .Process for making gold salt for use in electroplating[P].US 6423202,2002-07-23. |
[8] | 张东山.金盐生产技术研究[J].黄金,2003(05):4-8. |
[9] | 周全法,王琪,徐正.鼓氧氰化法生产高纯度氰化亚金钾的研究[J].黄金,2002(05):34-36. |
[10] | V A Fridman;V A Bogdanovskaya;M R Tarasevich .Electrocatalytic reduction of hydrogen Peroxide on polymethylpyrrole-peroxidase composite film plated on gold electrode[J].Russian Journal of Electrochemistry,2002,38(05):539-543. |
[11] | Fabian Mohr;Sergio Sanz;Elena Vergara .Water-soluble and Water-stable Gold(Ⅰ),Gold(Ⅱ)and Gold(Ⅲ) Sulfite Complexes[J].Gold Bulletin,2006,39(04):212-215. |
[12] | Jose Vicente;M Teresa Chicote;M Dolores Abrisqueta .Recent Advances in the Chemsitry of Gold(I) Complexes with C-, N- and S-Donor Ligands Part I: Alkynyl, Amino, Imino and Nitrido Derivatives[J].Gold Bulletin,1998(3):83-87. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%