介绍了介电材料表面金属化技术的发展概况.简述了原有化学镀工艺的缺点,着重介绍了近十余年来塑料电镀、PC板孔金属化、直接镀工艺三方面的发展:表面化学改性膜、碳胶膜、导电聚合物膜工艺.介绍了几种商品工艺.
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