用电化学测试技术研究了铜在Hac-KOH-KClO3化学机械抛光液中的腐蚀与钝化,分析了钝化膜的成分,研究了成膜的伏安曲线特征,考察了化学机械抛光过程中铜腐蚀电位随时间变化的轨迹、钝化膜的磨损与再钝化以及铜的极化曲线.结果表明,铜在Hac-KOH-KClO3化学机械抛光液中钝化膜主要由Cu2O和CuCl组成,CuCl的存在改善了铜的抛光特性.钝化膜的成膜过程符合Müller钝化成膜模型.氯酸钾的存在不仅加快了化学机械抛光过程中的钝化成膜速率和磨损除膜速率,而且降低了抛光磨损的压力和转速,大幅提高了抛光中的腐蚀电流密度,加快了铜的腐蚀.
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