微电子技术的迅速发展要求电子元件薄膜化,从而促进了磁性薄膜的发展.为了达到控制溅射非晶态薄膜磁性的目的,从溅射非晶态薄膜的组成成分、溅射工艺参数、基体材料及温度、膜层厚度和镀后热处理工艺等几方面论述了影响非晶态溅射薄膜磁性的因素,结果表明,薄膜组成、膜厚、基材、溅射工艺及镀后热处理对溅射非晶态薄膜的磁性有较大的影响,应根据不同磁性要求加以控制.
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