铜的性质决定了铜在工业应用中的重要性,特别是目前在微电子工业中的决定性作用,使铜的电沉积过程成为研究热点.结合铜在微电子工业中的应用,综述了硫酸盐镀铜中铜的电沉积机理、铜镀层微结构、添加剂对铜电沉积过程的影响以及铜电沉积初期行为方面的研究进展.指出了铜电沉积未来的研究方向.
参考文献
| [1] | D. Landolt .Electrodeposition Science and Technology in the Last Quarter of the Twentieth Century[J].Journal of the Electrochemical Society,2002(3):S9-S20. |
| [2] | Jonathan R .Copper electrodeposition:principles and recent progress.Jan[J].Journal of Applied Physics,2001,40:2650-2657. |
| [3] | Bockris J O M;Drazic D .The electrode kinetics of the deposition and dissolution of iron[J].Electrochimica Acta,1961,4(04):325-336. |
| [4] | 周绍民.金属电沉积-原理与研究方法[M].上海:上海科学技术出版社,1987:242-269. |
| [5] | 辜敏,杨防祖,黄令,姚士冰,周绍民.高择优取向铜镀层的电化学形成及其表面形貌[J].物理化学学报,2002(11):973-978. |
| [6] | Rashkov S;Stoichev D S;Tomov I .Influence of current density and temperature on the morphology and preferred orientation of electrodeposited copper coatings[J].Electrochimica Acta,1972,17:1955-1964. |
| [7] | Hu CC.;Wu CM. .Effects of deposition modes on the microstructure of copper deposits from an acidic sulfate bath[J].Surface & Coatings Technology,2003(1):75-83. |
| [8] | Hyo-Jong Lee;Dong Nyung Lee .Effects of Current Waveform and Bath Temperature on Surface Morphology and Texture of Copper Electrodeposits for ULSI[J].Materials Science Forum,2002(Pt.2):1657-1662. |
| [9] | 吉元,钟涛兴,李志国,王晓东,夏洋,BALK L J,LIU Xiao-xia,ALTES A.Cu互连线显微结构和应力的AFM及SNAM分析[J].电子显微学报,2003(01):56-59. |
| [10] | Winand R .Electrocrystallization:Fundamental considerations and application to high current density continuous steel sheet plating[J].Journal of Applied Electrochemistry,1991,21(05):377-389. |
| [11] | Kozlov VM.;Bicelli LP. .Influence of the nature of metals on the formation of the deposit's polycrystalline structure during electrocrystallization[J].Journal of Crystal Growth,1999(1/2):255-260. |
| [12] | Chène O;Landolt D .The influence of mass transport on the deposit morphology and the current efficiency in pulse plating of copper[J].Journal of Applied Electrochemistry,1989,19(02):188-194. |
| [13] | D. Stoychev .On the role of poly (ethylene glycol) in deposition of galvanic copper coatings[J].Transactions of the Institute of Metal Finishing,1998(2):73-80. |
| [14] | Schmidt WU.;Gewirth AA.;Alkire RC. .MECHANIC STUDY OF COPPER DEPOSITION ONTO GOLD SURFACES BY SCALING AND SPECTRAL ANALYSIS OF IN SITU ATOMIC FORCE MICROSCOPIC IMAGES[J].Journal of the Electrochemical Society,1996(10):3122-3132. |
| [15] | Nichols R J;Schroer D;Meyer H .An in situ scanning probe microscopy study of copper electrodeposition on conductive polypyrrole[J].Electrochimica Acta,1995,40(10):1479-1485. |
| [16] | Becky T.Y.;Kang M. .Benzotriazole as an Additive for Copper Electrodeposition Influence of Triazole Ring Substitution[J].Journal of the Electrochemical Society,2000(9):3326-3337. |
| [17] | Armstrong M J;Muller R H .In situ scanning tunneling microscopy of copper deposition with benzotriazole[J].Journal of the Electrochemical Society,1991,138(08):2303-2307. |
| [18] | P. M. Vereecken;R. A. Binstead;H. Deligianni;P. C. Andricacos .The chemistry of additives in damascene copper plating[J].IBM journal of research and development,2005(1):3-18. |
| [19] | M. A. Pasquale;D. P. Barkey;A. J. Arvia .Influence of Additives on the Growth Velocity and Morphology of Branching Copper Electrodeposits[J].Journal of the Electrochemical Society,2005(3):C149-C157. |
| [20] | Budevski E;Staikov G J;Lorenz W.Electrochemical phase formation and growth--An introduction to the initial stages of metal deposition[M].Weinheim:VCH Verlagsgesellschaft mbH,1996 |
| [21] | Danilov A I;Molodkina E B;Polukarov Y M .Initial stage of the copper electrocrystallization from a sulfate acid electrolyte:chronoamperometry at a platinum ring-disk electrode[J].Russian Journal of Electrochemistry,2000,36(09):1118-1129. |
| [22] | Crousier J;Bimaghra I .Electrodepostion of copper from sulfate and chloride solution[J].Electrochimica Acta,1989,34(08):1205-1211. |
| [23] | Darko Grujicic;Batric Pesic .Electrodeposition of copper: the nucleation mechanisms[J].Electrochimica Acta,2002(18):2901-2912. |
| [24] | Fabricius G;Kontturi K;Sundholm G .Influence of thiourea on the nucleation of copper from acid sulphate solution[J].Electrochimica Acta,1994,39(16):2353-2357. |
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