以水合肼为还原剂还原硝酸银溶液,以沉淀法制备微细银粉,再经机械球磨得到光亮片状银粉.为提高以片状银粉为填料的复合物的导电性,有必要去除银粉球磨过程中化学吸附在银粉表面的润滑层.利用醇酸混合液对光亮片状银粉进行表面化学处理,采用差示扫描热分析(DSC)研究了处理前后片状银粉的热性能,并用扫描电镜和能谱分析仪(EDAX)对处理前后的片状银粉的表面进行了形貌观察和成分分析.结果表明,醇酸混合液可以完全去除光亮片状银粉表面化学吸附的润滑剂(油酸),同时探讨了片状银粉表面油酸的去除机理.
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