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介绍了化学镀银工艺中粉体表面预处理的方法,综述了近年来金属粉体、无机粉体和高分子粉体化学镀银的研究和应用状况,分别讨论了3种粉体在化学镀银中的镀液稳定性、粉体表面的催化活性、镀银过程中粉体的分散性及镀层的均匀性等问题,并提出了今后粉体镀银工作的发展方向.

参考文献

[1] 常英,刘彦军.片状镀银铜粉的制备及性能表征[J].化工新型材料,2005(04):56-58.
[2] Ebrahimi F;Zhai Q;Kong D.Mechanical properties of Cu/Ag multilayered composites[J].Materials Science and Engineering,1998(255):20.
[3] Xu X R;Luo X J;Zhuang H R.Electroless silver coating on fine copper powder and its effects on oxidation resistance[J].MATERIALS LETTERS,2003(57):3987.
[4] Otop H. .Growth of silver films on Cu(111) at low temperatures[J].Vacuum: Technology Applications & Ion Physics: The International Journal & Abstracting Service for Vacuum Science & Technology,2002(2):285-291.
[5] 黄少强,邱文革,李生华.非金属材料表面化学镀银[J].北京工业大学学报,2005(01):75-80.
[6] 凌国平.金属包覆型复合粉末及其在工程材料中的应用[J].机械工程材料,2005(03):44-46.
[7] 时刻,黄英,李鹏,廖梓珺.非金属材料化学镀的应用新进展[J].玻璃钢/复合材料,2005(02):45-48,40.
[8] 李酽,刘刚,刘红霞,刘传生,李铀,王芬.化学镀层的性能及基体的镀前处理[J].航空制造技术,2004(07):86-88.
[9] Yang GH.;Neoh KG.;Kang ET. .Electroless deposition of copper and nickel on poly(tetrafluoroethylene) films modified by single and double surface graft copolymerization[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2001(1/4):165-177.
[10] Esrom H;Seebock R;Charbommier M.Surface activation of polyimide with dielectric barrier discharge for electroless metal depositon[J].SURFACE AND COATINGS TECHNOLOGY,2000(125):19-24.
[11] Fahler S.;Weisheit M.;Sturm K.;Krebs HU.;Kahl S. .The interface of laser deposited Cu/Ag multilayers: evidence of the 'subsurface growth mode' during pulsed laser deposition[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2000(0):419-423.
[12] Lee C L;Wan C C;Wang Y Y .Synthesis of Metal Nanoparticles Via Self-Regulated Reduction by an Alcohol Srufactant[J].Advanced in Functional Materials,2001,11(03):344-347.
[13] 钱苗根.材料表面技术及其应用手册[M].北京:机械工业出版社,1998:206.
[14] G.D. Sulka;M. Jaskula .Study of the kinetics of silver ions cementation onto copper from sulphuric acid solution[J].Hydrometallurgy,2003(1/3):185-196.
[15] 廖辉伟,李翔,彭汝芳,王兴明.包覆型纳米铜-银双金属粉研究[J].无机化学学报,2003(12):1327-1330.
[16] 吴懿平,吴大海,袁忠发,吴丰顺,安兵.镀银铜粉导电胶的研究[J].电子元件与材料,2005(04):32-35.
[17] 吴秀华,赵斌,邵佳敏.不同形貌Cu-Ag双金属粉的制备及性能[J].华东理工大学学报(自然科学版),2002(04):402-405.
[18] Yoshio Kobayashi;Veronica Salgueirino-Maceira;Luis M. Liz-Marzan .Deposition of Silver Nanoparticles on Silica Spheres by Pretreatment Steps in Electroless Plating[J].Chemistry of Materials,2001(5):1630-1633.
[19] Marnix V.ten Kortenaar;Jeroen J.M.de Goeij;Zovonimr I.Kolar;Gert Frens;Pieter J.Lusse;Marc.R.Zuiddam;Emile van der Drift .Electroless Silver Deposition in 100 nm Silicon Structures[J].Journal of the Electrochemical Society,2001(1):C28-C33.
[20] 黄磊,凌国平,郦剑.纳米Ag-Al2O3复合粉末的制备[J].浙江大学学报(工学版),2003(01):65-69.
[21] 王宇,张骁勇,毛丽,曹志壮.空心玻璃微珠化学镀银的研究[J].材料科学与工程学报,2004(05):753-756.
[22] 王为,郭鹤桐,王慧.高分子复合导电微球的制备及其应用初探[J].材料保护,1999(05):6.
[23] Gray JE;Norton PR;Griffiths K .Mechanism of adhesion of electroless-deposited silver on poly(ether urethane)[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2005(1/2):196-207.
[24] Yi Li;Qinghua Lu;Xuefeng Qian;Zikang Zhu;Jie Yin .Preparation of surface bound silver nanoparticles on polyimide by surface modification method and its application on electroless metal deposition[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2004(1/4):299-306.
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