微纳米尺度构件作为微纳米机电系统的重要组成部分,其力学性能是设计、制造微纳米机电系统的重要参数,对微纳米机电系统的使用性能、可靠性、服役寿命等均会产生显著的影响.由于受到量子效应、尺度效应、表面效应的影响,传统的测试技术已无法满足需要.结合国内外微纳米尺度构件力学性能测试的最新动态,介绍了纳米压入法、鼓泡法、微拉伸法、微梁弯曲法等测试方法的机理、应用及存在的主要问题.最后指出了微尺度力学性能测试的发展方向.
参考文献
| [1] | 张泰华.影响纳米压入测试结果的因素[J].实验力学,2004(04):437-442. |
| [2] | 赵则祥,蒋庄德,王海容.纳米压入法微机械材料力学性能测量不确定度的影响因素分类及评价[J].稀有金属材料与工程,2002(05):363-366. |
| [3] | V Raman;P Berriche .An inrestigation of the creep processes in tin and aluminum using a depth-sensing indentation technique[J].Journal of Materials Science,1992,7(03):627-638. |
| [4] | J M Calderon-Moreno;F Guiu;M Meredith et al.Fracture toughness anisotropy of PZT[J].Materials Science and Engineering A,1997,234-236:1062-1066. |
| [5] | Xiaodong Li;Bharat Bhushan .Micro/nanomechanical characterization of ceramic films for microdevices[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1999(1/2):210-217. |
| [6] | 任凤章,周根树,赵文轸,胡志忠,郑茂盛,鞠新华.鼓泡法测量有机薄膜力学性能[J].自然科学进展,2002(06):636-640. |
| [7] | Karimi A.;Kruml T.;Martin JL.;Shojaei OR. .CHARACTERISATION OF TIN THIN FILMS USING THE BULGE TEST AND THE NANOINDENTATION TECHNIQUE[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,1997(0):334-339. |
| [8] | Hohlfelder R J .Measuring interfacial fracture toughness with the blister test[J].thin film:stresses and mechanical properties,1997,436:115. |
| [9] | Guckel H;Burns D;Rutigliano C.Diagnostic microstructures for the measurement of interinnic strain in thin film tennle strain measurement[J].Journal of Micromechanics and Microengineering,1992(02):86-95. |
| [10] | 张泰华,杨业敏,赵亚溥,白以龙.MEMS材料力学性能的测试技术[J].力学进展,2002(04):545-562. |
| [11] | Xiong Xingguo;Zou Qiang;Lu Derren.Balance-appoach for load-displacement of microstruement[J].Mechatronics,1998(08):549-559. |
| [12] | Ming Qin;M.C. Poon;C.Y. Yuen .A study of nickel silicide film as a mechanical material[J].Sensors and Actuators, A. Physical,2000(1/2):90-95. |
| [13] | T.-Y.Zhang;Y.-J.Su .Mmicrobridge testing of silicon nitride thin films deposited on silicon wafers[J].Acta materialia,2000(11):2843-2857. |
| [14] | 丁建宁,孟永钢,温诗铸.微结构和尺寸约束下多晶硅微机械构件拉伸强度的尺寸效应[J].科学通报,2001(05):436-440. |
| [15] | 吴恒安,王秀喜,梁海弋,刘光勇.金属纳米丝力学行为研究进展[J].金属学报,2002(09):903-907. |
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