非晶态Ni-Pd-P合金薄膜具有非常好的热传导性和耐磨性,因而被广泛用作防护镀层.铜片由于其良好的导电性能被选为生长非晶态Ni-Pd-P合金薄膜的衬底材料.主要研究半固着磨具精密研磨非晶态Ni-Pd-P合金薄膜铜片衬底,以铜片衬底的表面粗糙度和材料去除率为评价指标,探讨了研磨过程中不同的工艺参数对铜片表面粗糙度和材料去除率的影响.结果表明:用800# SiC半固着磨具对铜片衬底进行研磨加工,10min后铜片表面粗糙度Ra可由0.553μm减小到0.28μm,同时表面无深划痕.加工后的铜片再经金刚石研磨膏抛光可快速获得满足Ni-Pd-P合金薄膜生长用的铜片衬底表面.
参考文献
| [1] | Brenner A;Couch D E;Williams E K .Electrodeposition of alloys of phoshorus with nickel or cobalt[J].Journal of Research of the National Bureau of Standards,1950,44:109-119. |
| [2] | 杜炳志,漆红兰.电化学抛光技术新进展[J].表面技术,2007(02):56-58. |
| [3] | 关佳亮,于新爱,杨朝旭.H62黄铜精密镜面抛光工艺的实验研究[J].金刚石与磨料磨具工程,2006(05):97-99. |
| [4] | V. Nguyen;H. VanKranenburg;P. Woerlee .Dependency of dishing on polish time and slurry chemistry in Cu CMP[J].Microelectronic engineering,2000(1/4):403-410. |
| [5] | Jianfeng Luo;Dornfeld D.A. .Material removal mechanism in chemical mechanical polishing: theoryand modeling[J].IEEE Transactions on Semiconductor Manufacturing: A Publication of the IEEE Components, Hybrids, and Manufacturing Technology Society, the IEEE Electron Devices Society, the IEEE Reliability Society, the IEEE Solid-State Circuits Council,2001(2):112-133. |
| [6] | 袁巨龙,王志伟,文东辉,吕冰海,戴勇.超精密加工现状综述[J].机械工程学报,2007(01):35-48. |
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