以往在石墨粉表面镀铜存在过程复杂、成本高的缺点,为了改变这种状况,采用化学置换镀的方法在石墨粉表面镀铜,观察了镀铜石墨粉的微观形貌,研究了影响化学置换镀铜的主要因素,分析了化学置换镀铜的机理.实验结果表明:在用镀铜石墨粉制备的复合材料中,铜能形成连续的三维网络结构,有利于提高材料的性能;采用铁粉做还原剂时,为了提高镀覆质量,镀液的最佳pH值应为3左右,搅拌速率应控制在40～60r/min,温度应控制在60℃左右;与铝、锌相比,铁作还原剂具有镀覆效果好、副反应少、成本低等优点,有利于工业推广.
Plating copper on the surface of graphite powders had defect of complex process and high cost in the past, in order to change this status, the method of chemistry-replacement to plate copper on the surface of graphite powders was used, the microstructure of copper-coated graphite powders was watched, the main factors of impacting on plating copper by using the method of chemistry-replacement were researched; The principle of plating copper by chemistry-replacement was analyzed. The experimental results showed: The copper could form continuous meshwork of three dimensions, which was propitious to enhance the material's performance; In order to enhance the quality of plating copper, the best solution for the pH value was 3 or so when we used iron as reducer, and the stirring speed should be controlled in the 40～60 switches per minute, the reaction temperature should be controlled in 60℃ or so; Comparing to aluminum and zinc, using iron as reducer had the strongpoint of better coating quality,fewer vice reactions and lower cost, which was propitious to spread in industry.
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