在电化学沉积金中添加微量的硬化剂钴或镍得到的硬化金通常具有较好的硬度、耐腐蚀性和耐磨性.硬化金被广泛应用为接触材料.介绍了对硬化金的电镀过程以及相应的镀层性质的研究.重点介绍了金的电化学还原机理、硬化剂的作用原理以及孔隙的形成和降低方法.最后介绍了新的电镀工艺和新合金以得到较小的孔隙率,从而可以减少金的用量,而不用牺牲其机械、电气和抗腐蚀性能.
参考文献
| [1] | Christie I;Cameron B .Gold Electrodeposition Within the Electronics Industry[J].Gold Bulletin,1994,27(01):12-20. |
| [2] | Horn G;Merl W .Friction and Wear of Electroplated Hard Gold Deposits for Connectors[J].Parts Hybrids and Packaging IEEE Transactions on,1974,10(01):53-59. |
| [3] | Hall E O.The Deformation and Ageing of Mild Steel:ⅢDiscussion of Results[J].Proceedings of the Physical Society Section B,1951(09):747. |
| [4] | NING WANG;ZHIRUI WANG;K. T. AUST;U. ERB .EFFECT OF GRAIN SIZE ON MECHANICAL PROPERTIES OF NANOCRYSTALLINE MATERIALS[J].Acta Metallurgica et Materialia,1995(2):519-528. |
| [5] | Lo C C;Augis J A;Pinnel M R .Hardening mechanisms of hard gold[J].Journal of Applied Physics,1979,50(11):6887-6891. |
| [6] | Kohl P A;Milan Paunovic M S.Modern electroplating The Electrochemical Society series[M].New York:wiley,2010:115-130. |
| [7] | Rehrig D L .Effect of Deposition Method on Porosity in Au thin films[J].Plating,1974,61(01):43-47. |
| [8] | Paunovic M.Electrochemical Deposition Encyclopedia of Electrochemistry[M].New York:wiley,2007:87-158. |
| [9] | Notter I M;Gabe D R .Porosity of electrodeposited coatings:its cause,nature,effect and management[J].Corrosion Reviews,1992,10(3-4):217-280. |
| [10] | Popov K I .Fundamental aspects of pulsating current metal electrodeposition Ⅰ:The effect of the pulsating current on the surface roughness and the porosity of metal deposits[J].Surface Technology,1980,11(02):99-109. |
| [11] | Zhengwei Liu;Min Zheng;Robert D Hilty;Alan C. Westa .Effect of Morphology and Hydrogen Evolution on Porosity of Electroplated Cobalt Hard Gold[J].Journal of the Electrochemical Society,2010(7):D411-D416. |
| [12] | Bindra P .Effect of base metal ions on the electrochemical and structural characteristics of electrodeposited gold films[J].Journal of the Electrochemical Society,1989,136(12):3616-3626. |
| [13] | Cheh H Y;Sard R .Electrochemical and Structural Aspects of Gold Electrodeposition from Dilute Solutions by Direct Current[J].Journal of the Electrochemical Society,1971,118(11):1737-1747. |
| [14] | Li YG.;Lasia A. .NUCLEATION AND CRYSTAL GROWTH IN GOLD ELECTRODEPOSITION FROM ACID SOLUTION .2. HARD GOLD[J].Journal of Applied Electrochemistry,1996(8):853-863. |
| [15] | Li YG.;Lasia A. .ELECTRODEPOSITION OF HARD GOLD FROM ACIDIC SOLUTION - THE INFLUENCE OF SUBSTRATES[J].Journal of the Electrochemical Society,1997(6):1979-1988. |
| [16] | E. Budevski;G. Staikov;W. J. Lorenz .Electrocrystallization nucleation and growth phenomena[J].Electrochimica Acta,2000(15/16):2559-2574. |
| [17] | Q. Huang;H. Deligianni;L. T. Romamkiw .Electrodeposltion of Gold on Silicon Nucleation and Growth Phenomena[J].Journal of the Electrochemical Society,2006(5):C332-C336. |
| [18] | Milan Paunovic M S.Fundamentals of Electrochemical Deposition[M].New York:John Wiley and Sons,Inc,1998:122-124. |
| [19] | Nakahara S .On the growth morphology of hard gold electrodeposits[J].Journal of Crystal Growth,1986,75(02):212-220. |
| [20] | Okinaka Y;Nakahara S .Structure of Electroplated Hard Gold Observed by Transmission Electron Microscopy[J].Journal of the Electrochemical Society,1976,123(09):1284-1289. |
| [21] | Okinaka Y ."Polymer” Inclusions in Cobalt-Hardened Electroplated Gold[J].Journal of the Electrochemical Society,1978,125(11):1745-1750. |
| [22] | Leidheiser J H .The Chemical State of Cobalt in CobaltHardened Gold Electrodeposits[J].Journal of the Electrochemical Society,1979,126(03):391-394. |
| [23] | Abrahams S C;Zyontz L E;Bernstein J L .Cobalt cyanoaurate:Crystal structure of a component from cobalthardened gold electroplating baths[J].Journal of Chemical Physics,1982,76(11):5458-5462. |
| [24] | Yutaka Okinaka .Significance of Inclusions in Electroplated Gold Films for Electronics Applications[J].Gold Bulletin,2000(4):117-127. |
| [25] | Nakahara S;Okinaka Y .Inclusions in Electroplated Additive-Free Hard Gold[J].Journal of the Electrochemical Society,1981,128(02):284-288. |
| [26] | Ghaziof, S.;Raeissi, K.;Golozar, M.A. .Improving the corrosion performance of Cr-C amorphous coatings on steel substrate by modifying the steel surface preparation[J].Surface & Coatings Technology,2010(7):2174-2183. |
| [27] | Kudrak E J;Abys J A;Humiec F .The Impact of Substrate Roughness on Porosity:A Comparison of Electroplated Palladium,Palladium-Nickel & Cobalt Hard Gold[J].Plating and Surface Finishing,1997,84(01):32-37. |
| [28] | Celis J P;Roos J R;Fan C .Porosity of electrolytic nickel-phosphorus coatings[J].Transactions of the Institute of Metal Finishing,1991,69(01):15-19. |
| [29] | Ponte HA.;Maul AM. .Porosity determination of nickel coatings on copper by anodic voltammetry[J].Journal of Applied Electrochemistry,2002(6):641-646. |
| [30] | 杨海钢,朱雪梅,雷明凯.腐蚀电化学方法评价硬质涂层孔隙率[J].腐蚀科学与防护技术,2005(06):413-417. |
| [31] | Brenner A.Electrodeposition of Alloys:Principles and Practice[M].Academic Press,Inc,1963:609-626. |
| [32] | Paunovic M;Schlesinger M.Modern electroplating.Electrochemical Society series[M].New York:wiley,2010:327-368. |
| [33] | Walsh FC;de Leon CP;Kerr C;Court S;Barker BD .Electrochemical characterisation of the porosity and corrosion resistance of electrochemically deposited metal coatings[J].Surface & Coatings Technology,2008(21):5092-5102. |
| [34] | Lin K;Weil R;Desai K .Effects of Current Density,Pulse Plating,and Additives on the Initial Stage of Gold Deposition[J].Journal of the Electrochemical Society,1986,133(04):690-692. |
| [35] | Popov K I .The effect of pulsating potential electrolysis on the porosity of metal deposits[J].Journal of Applied Electrochemistry,1976,6(02):155-157. |
| [36] | Angerer H;Ibl N .On the electrodeposition of hard gold[J].Journal of Applied Electrochemistry,1979,9(02):219-232. |
| [37] | Zhengwei Liu;Alan C. West .Modeling of galvanostatic pulse and pulsed reverse electroplating of gold[J].Electrochimica Acta,2011(9):3328-3333. |
| [38] | Raub C;Knodler A .The Electrodeposition of Gold by Pulse Plating[J].Gold Bulletin,1977,10(02):38-44. |
| [39] | Ibl N .Some Theoretical aspects of pulse electrolysis[J].Surface Technology,1980,10(02):81-104. |
| [40] | Puippe J C.Theory and practice of pulse plating[M].Orlando:Amer Electroplaters Soc,1986:58-65. |
| [41] | Zhengwei Liu;Min Zheng;Robert D. Hilty;Alan C. West .The effect of pulse reversal on morphology of cobalt hard gold[J].Electrochimica Acta,2011(5):2546-2551. |
| [42] | Sjoegren L .Properties of nickel-hardened gold plated with low-frequency periodic reverse current[J].Plating and Surface Finishing,1986,73(03):70-73. |
| [43] | Cheh H Y .The Limiting Rate of Deposition by P-R Plating[J].Journal of the Electrochemical Society,1971,118(07):1132-1134. |
| [44] | Kirk D W;Foulkes F R;Graydon W F .A Study of Anodic Dissolution of Gold in Aqueous Alkaline Cyanide[J].Journal of the Electrochemical Society,1978,125(09):1436-1443. |
| [45] | Mac Arthur D M .A Study of Gold Reduction and Oxidation in Aqueous[J].Solutions Journal of the Electrochemical Society,1972,119(06):672-677. |
| [46] | Liu ZW;Wu J;West AC .Electrochemical Quartz Crystal Microbalance Studies of Gold Oxidation in Cyanide Baths[J].Electrochemical and solid-state letters,2011(1):D1-D4. |
| [47] | Chalumeau L;Wery M;Ayedi HF;Chabouni MM;Leclere C .Development of a new electroplating solution for electrodeposition of Au-Co alloys[J].Surface & Coatings Technology,2006(3/4):1363-1372. |
| [48] | Chalumeau L;Wery M;Ayedi HF;Chabouni MM;Leclere C .Application of a Doehlert experimental design to the optimization of an Au-Co plating electrolyte[J].Journal of Applied Electrochemistry,2004(11):1177-1184. |
| [49] | Huerta F;Mele C;Bozzini B;Morallon E .Voltammetric and in situ FTIRS study on CN- and Au(CN)(-)(x) complexes at the polycrystalline gold surface in citrate medium[J].Journal of Electroanalytical Chemistry: An International Journal Devoted to All Aspects of Electrode Kinetics, Interfacial Structure, Properties of Electrolytes, Colloid and Biological Electrochemistry,2004(1):53-60. |
| [50] | Masaru Kato;Kazutaka Senda;Yuta Musha;Junji Sasano;Yutaka Okinaka;Tetsuya Osaka .Electrodeposition of amorphous gold alloy films[J].Electrochimica Acta,2007(1):11-15. |
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