通过向Ni-P二元合金镀层中引入微量B元素,制备了性能优异的Ni-P-B三元合金镀层.研究了镀液中络合剂甘氨酸和乳酸、还原剂次磷酸钠和硼氢化钾对镀速、镀层成分的影响,确定镀液的最佳配方及工艺条件为25 g/L NiSO4·6H2O,30 g/L NH2CH2COOH,20 g/L CH3CH(OH) COOH,25 g/L NaH2PO2,0.2 g/L KBH4,1 mg/L CdSO4·8H2O,pH=12,θ=69～71℃.并对在最佳工艺条件下获得的镀层进行了耐腐蚀性、可焊性及与基体结合力的测试.结果表明,该镀层具有较好的抗腐蚀性和可焊性,并且与铜基体结合牢固.
参考文献
| [1] | 李乙翘;陈长生.印制电路[M].北京:化学工业出版社,2007:211-219. |
| [2] | 林金堵.SMT使PCB走上新一代产品[J].印制电路信息,2002(01):12-15. |
| [3] | El-Mallah A Talaat;Abbas M Hassib;Shafei M Farid et al.Structure of electroless nickel deposits from baths containing sodium hypophosphite and potassium borohydride[J].Plating and Surface Finishing,1989,76(05):124-128. |
| [4] | Mital C K;Shrvastava P B .Electroless nickel-phosphorous-boron alloy coatings[J].Metal Finishing,1986,84(10):67-70. |
| [5] | Kaufman C M.Sen B.Hydrogen generation by hydrolysis of sodium tetrahydroborate:Effects of acids and transition metals and their salts[J].Journal of the Chemical Society,Dalton Transactions,1985(02):307-313. |
| [6] | Kreevoym M;Jacobson R W.The rate of decomposition of NaBH4 in basic aqueous solutions[J].Ventron Alembic,1979(15):2-3. |
| [7] | GB/T 9491-202,锡焊用液态焊剂(松香型)[S]. |
| [8] | GB/T 2423.32-2008,电工电子产品环境试验,第2部分:试验方法,试验Ta:润湿称量法可焊性[S]. |
| [9] | GB/T 2423.28-2005,电工电子产品环境试验,第2部分:试验方法,试验T:锡焊[S]. |
| [10] | 姜晓霞;沈伟.化学镀理论与实践[M].北京:国防工业出版社,2000:26-91. |
| [11] | Boquan Jiang;Lin Xiao;Shufen Hu;Jian Peng;Hua Zhang;Minwei Wang .Optimization and kinetics of electroless Ni-P-B plating of quartz optical fiber[J].Optical materials,2009(10):1459-1466. |
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