研究了以乙醛酸为还原剂的化学镀铜工艺、镀层结构和形貌.其镀液组成和操作条件为:28.0 g/L CuSO4·5H2O,44.0 g/L EDTA-2Na,10.0 mg/L α,α'-联吡啶,10.0 mg/L亚铁氰化钾,9.2g/L乙醛酸,pH为11.5 ～12.5,θ为40 ～ 50℃.实验结果表明,化学镀铜溶液较稳定；镀液温度和硫酸铜质量浓度提高,铜沉积速率增大；较高的镀液温度下,化学镀铜反应的活化能较低,镀液稳定性下降；镀液pH在11.5～12.5可获得较好的铜镀层；随乙醛酸和络合剂质量浓度提高,铜沉积速率变化不大,但过量的乙醛酸导致镀液的稳定性降低；铜镀层为面心立方混晶结构,呈光亮的粉红色块状形貌,有较高的韧性.
参考文献
| [1] | S. Z. Chu;M. Sakairi;H. Takahashi .Copper electroless plating at selected areas on aluminum with pulsed Nd-YAG laser[J].Journal of the Electrochemical Society,2000(4):1423-1434. |
| [2] | 胡光辉,连锦明,杨防祖,林昌健.陶瓷基上化学镀铜[J].电镀与涂饰,2001(02):1-4. |
| [3] | Edith Steinhaeuser .Potential low-cost palladium-alternatives for activating electroless copper deposition[J].Circuit world,2010(3):4-8. |
| [4] | Sung Ki Cho;Taeho Lim;Hong-Kee Lee .A Study on Seed Damage in Plating Electrolyte and Its Repairing in Cu Damascene Metallization[J].Journal of the Electrochemical Society,2010(4):D187-D192. |
| [5] | Lee C H;Kim A R;Koo H C et al.Effect of 2-mercapto5-benzimidazolesulfonic acid in superconformal Cu electroless deposition[J].Journal of the Electrochemical Society,2009,156(06):D207-D210. |
| [6] | Yu-Hsien Chou;Yuh Sung;Yih-Ming Liu .Defect-Free Copper Filling Using Nonisothermal Electroless Deposition with Fluorocarbon Surfactant[J].Journal of the Electrochemical Society,2008(12):791-797. |
| [7] | Shih-Chun Huang;Ting-Chieh Tsao;Li-Jen Chen .Selective Electroless Copper Plating on Poly(ethylene terephthalate) Surfaces by Microcontact Printing[J].Journal of the Electrochemical Society,2010(4):D222-D227. |
| [8] | Andreas Mobius;Danica Elbick;Ernst-Rudolf Weidlich;Klaus Feldmann;Florian Schussler;Jochen Borris;Michael Thomas;Antje Zanker;Claus-Peter Klages .Plasma-printing and galvanic metallization hand in hand - A new technology for the cost-efficient manufacture of flexible printed circuits[J].Electrochimica Acta,2009(9):2473-2477. |
| [9] | L. L. Duda .Effect of isomeric dipyridyls on electroless copper deposition from EDTA solutions[J].Plating & Surface Finishing,1998(7):60-62. |
| [10] | Wu H Y;Kang E T;Neoh .Electroless deposition of copper on surface modified poly(terafluoroethylene)films from graft copolymerization and silanization[J].Langmuir,2000,16:5192-5198. |
| [11] | Hsu D T;Iskandar M;Shi F G et al.Compatibility of the low-dielectric-content poly(arylether)with the electroless copper deposition solution[J].Journal of the Electrochemical Society,1999,146(12):4565-4568. |
| [12] | 杨防祖,杨斌,陆彬彬,黄令,许书楷,周绍民.以次磷酸钠为还原剂化学镀铜的电化学研究[J].物理化学学报,2006(11):1317-1320. |
| [13] | Chemical 'kick start' for the autocatalytic formaldehyde-free electroless copper plating process[J].Circuit world,2010(2):P.20. |
| [14] | Shacham-Diamand;Yosi Y .Electroless deposition using glyoxylic acid as reducing agent for ultralarge-scale integration metallization[J].Electro-Chem Solid-State Lett,2000,3(06):279-282. |
| [15] | Homna H;Kobayashi T .Electroless copper deposition process using glyoxylic acid as a reducing agent[J].Journal of the Electrochemical Society,1994,141(03):730-733. |
| [16] | 吴丽琼,杨防祖,黄令,孙世刚,周绍民.乙醛酸化学镀铜的电化学研究[J].电化学,2005(04):402-406. |
| [17] | 申丹丹,杨防祖,吴辉煌.2,2'-联吡啶和亚铁氰化钾对乙醛酸化学镀铜的影响[J].电化学,2007(01):67-71. |
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