欢迎登录材料期刊网

材料期刊网

高级检索

在硫酸铜电解液中加入硫酸钠,利用电沉积和X-射线衍射方法研究了不同提纯铜工艺制备的铜镀层及织构特征.结果表明,织构度受到电流密度、镀层厚度和温度的影响,在较小的电流密度、较高温度及在较薄厚度的铜镀层得到(111)晶面择优取向,在较高的电流密度及在镀层δ达到30μm时得到(220)晶面择优取向,而且铜镀层(220)晶面比(111)晶面更易保留,(220)晶面使纯铜能获得更好的电化学性能,保持纯铜晶面的择优取向对铜在半导体的应用产生了深远的影响.

参考文献

[1] J.Y. Choi;D.S. Kim .Production of ultrahigh purity copper using waste copper nitrate solution[J].Journal of hazardous materials,2003(2):147-158.
[2] Masanori Kato .The Production of Ultrahigh-Purity Copper for Advanced Applications[J].JOM,1995(12):44-46.
[3] Cifuentes L.;Crisostomo G.;Ibanez JP.;Casas JM.;Alvarez F.;Cifuentes G. .On the electrodialysis of aqueous H2SO4-CuSO4 electrolytes with metallic impurities[J].Journal of Membrane Science,2002(1):1-16.
[4] Noe Cbeung;Rodnei Bertazzoli;Amauri Garcia .Numerical and experimental analysis of an approach based on variable solute distribution coeficients during purification by zone refining[J].Separation and Purification Technology,2007,52:504-511.
[5] Tames Kekesi;Minoru Isshiki .Ultra high purification of copper chloride solutions by anion exchange[J].Hydrometallurgy,1997,45:345-361.
[6] 辜敏,付遍红,杨明莉.硫酸盐镀铜的研究进展[J].材料保护,2006(01):44-47.
[7] Zhou Shao-min.Electrodeposition of Metal-Principle and Methods[M].上海:上海科学技术出版社,1987:242.
[8] Mirpuri K;Wendrock H;Menzel S;Wetzig K;Szpunar J .Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2006(2):703-717.
[9] Dong Nyung Lee;Sooyoung Kang;Jeomsik Yang .Relationship Between initial & Recrystallization Textures Of Copper Electrodeposits[J].Plating & Surface Finishing,1995(3):76-79.
[10] Surnev Sv;Tomov I .Orientation distributions by recovery behavior in electrodeposited copper layers at room tamperature[J].Journal of Applied Electrochemistry,1989,19:752-757.
[11] 乔瑞华,浦玉萍,张永强,赵鹏,吕广庶.脉冲铜沉积层织构及形貌的研究[J].电镀与涂饰,2010(03):17-19.
[12] Raminder Kaur N;Verma S K;Chakarvartir .Structural analysis of electrodeposited copper microstruetures fabricated through template synthesis[J].J Mater Sc,2007,42(03):3588-3591.
[13] 辜敏,鲜晓红.(110)晶面全择优取向Cu镀层的制备及其条件优化[J].物理化学学报,2006(03):378-382.
[14] 辜敏,杨防祖,黄令,姚士冰,周绍民.高择优取向Cu电沉积层的XRD研究[J].电化学,2002(03):282-287.
[15] 辜敏,杨防祖,黄令,姚士冰,周绍民.高择优取向铜镀层的电化学形成及其表面形貌[J].物理化学学报,2002(11):973-978.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%