以AgNO3为主盐,在氯化胆碱和水的化学镀银溶液中,通过循环伏安法、紫外分光光度法和原子吸收分光光度法对铜基化学镀银的镀银机理及银沉积动力学进行了研究.结果表明,在化学镀银过程中,Ag+被还原为Ag单质沉积于铜基体上,而铜基体则被氧化成Cu+存在于溶液中.通过对氯化胆碱浓度、银盐浓度和施镀温度等影响因素的考察和计算,推导出该溶液中置换法化学镀银的表观活化能及动力学沉积速率方程.
参考文献
[1] | 李乙翘;陈长生.印制电路[M].北京:化学工业出版社,2007:211-219. |
[2] | 林金堵.SMT使PCB走上新一代产品[J].印制电路信息,2002(01):12-15. |
[3] | Chartes R G;Whilow G A .Method of electroless depositing of gold onto superconducting particles[P].US,4971944,1989-02-21. |
[4] | Minna Arra;DongkaiShangguan;Dongji Xie;Janne Sundelin;Toivo Lepisto .Study of Immersion Silver and Tin Printed-Circuit-Board Surface Finishes in Lead-Free Solder Applications[J].Journal of Electronic Materials,2004(9):977-990. |
[5] | Robert D Mikkola;Qing Tang Jiang;Ronald Carpio et al.Bath Additive and Current Density Effects on Copper Electroplating Fill of Cu Damascene Structure[J].Materials Research Society,1999,564:399-405. |
[6] | MIKE BARBETTA .The Search for the Universal SURFACE FINISH[J].Printed circuit design,2004(2):34,36-38-0. |
[7] | 黄浩,魏喆良,张腾,唐电.置换法化学沉积银的动力学研究[J].金属热处理,2006(05):64-67. |
[8] | 藤岛昭;陈震.电化学测定方法[M].北京:北京大学出版社,1995:16-17. |
[9] | Abbott AP;Nandhra S;Postlethwaite S;Smith EL;Ryder KS .Electroless deposition of metallic silver from a choline chloride-based ionic liquid: a study using acoustic impedance spectroscopy, SEM and atomic force microscopy[J].Physical chemistry chemical physics: PCCP,2007(28):3735-3743. |
[10] | 张晓燕,张家鼎,吴正纯,宋润生,陈晓杰,曹泽淳.新型复合电接触材料的开发研究[J].上海大学学报(自然科学版),2000(01):91-94. |
[11] | 姜晓霞;沈伟.化学镀理论及实践[M].北京:国防工业出版社,2000:3-4. |
[12] | Boquan Jiang;Lin Xiao;Shufen Hu;Jian Peng;Hua Zhang;Minwei Wang .Optimization and kinetics of electroless Ni-P-B plating of quartz optical fiber[J].Optical materials,2009(10):1459-1466. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%