为提高电镀厚金层的存储性能,采用优化镀层预处理工艺方法,利用换向脉冲电镀技术在铍青铜试件上制备镀厚金层,并研究不同预处理工艺对长时间存储条件下镀层结合力的影响规律;利用X-射线能谱仪研究了优化预处理工艺对存储1～5年后镀厚金层的成分变化规律的影响;利用扫描电子显微镜与能谱仪研究了存储1～5年后镀层与铜基体之间的扩散行为.研究结果表明,换向脉冲电镀厚金层储存5年后,镀铜作为镀金的预镀层,镀层结合力最为优异;换向脉冲电镀厚金层的金原子数分数高于99.9％,镀厚金层具有优异的存储性能,但是镀厚金层界面处存在1.0～1.5 μm的相互扩散现象.
In order to improve the storage performance of thick gold coating,optimized pretreatment process and reversing pulse gold plating technology were used to prepare the coating.The effects of different pretreatment processes on bonding force of the coating under long time storage condition were studied;the effects of optimized pretreatment process on the change regulation of composition of coating stored for 1 to 5 years were studied using energy dispersive analysis by x-ray (EDAX),and diffusion behavior between the copper substrate and coating stored for 1 to 5 year was studied by scanning electron microscope (SEM) and energy dispersive spectrometer (EDS).Results showed that reversing pulse thick gold coating,which used copper coating as pre-coating,showed the most excellent bonding force after storing for 1 to 5 years the atomic fraction of the reversing pulse gold plated coating was higher than 99.9％,the thick gold coating had excellent storage performance,but 1.0 ～ 1.5 μm mutual diffusion could be observed at the interface between the thick gold coating and the copper substrate.
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