传统半自动电镀生产线在铜件表面镀银过程中,由于自动化程度较低,对各工艺环节的时间控制精度差,导致银镀层厚度、致密度、电导率和光亮度指标不稳定.设计一种铜件镀银生产线中直线电机自动驱动系统,首先设定不同的活化、浸银和电镀银等工序的时间,进行实验,提取不同时间下银镀层的厚度、电导率和光亮度指标;通过对比,选取各工序最优的控制时间,作为直线电机自动驱动系统硬件和参数设定的依据;软件流程采用智能PLC与单神经元控制相结合的算法,实现铜件表面镀银过程的自动化控制.实验证明,该设计系统能够精确的控制时间并精准定位,改善银镀层电导率和光亮度.
The traditional semi-automatic electroplating line in processing copper-based parts has low degree of automation,low time control precision,uneven thickness of silver coating,low density,conductivity and brightness.Automatic driving system of copper-based silver plating process was designed.Various factors were set up including different activation,silver leaching,silver plating and passivation time,respectively.Different extraction time were controlled by the thickness of silver coating,conductivity and brightness.The optimized control time was used as basis for the system hardware and automatic parameters.Software process mainly adopted combined intelligent PID and single neuron control algorithm.The experimental results show that the proposed linear motor drive system design can accurately control the time and precise positioning and improve the conductivity of the coating and the level of light intensity.
参考文献
- 下载量()
- 访问量()
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%