利用DSC和XRD对化学沉积Ni-P及Ni-Cu-P合金镀层的晶化行为进行了比较研究.结果表明:低磷Ni-P镀层直接转变为稳定相Ni3P,而低磷(高铜)Ni-Cu-P镀层则经生成亚稳中间相Ni5P2后再向稳定相Ni3P转变;高磷非晶态Ni-12.1%P(质量分数,下同)和Ni-17.96%Cu-9.29%P合金镀层均先形成亚稳中间相Ni5P2和Ni12P5后,再转变为稳定相Ni3P.但Ni-Cu-P合金镀层转变为亚稳相的温度比Ni-P镀层的高.
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