研究不同密度的Al2O3/SiC纳米复合材料在退火条件下的裂纹愈合行为.利用维氏压痕法引入可控的预制裂纹,通过测量退火前后材料抗弯强度的变化来表征裂纹愈合程度.当退火温度在850℃以上时,裂纹愈合效应随退火温度提高明显增强,在1150℃左右退火1h后,不同密度的试样的抗弯强度均恢复到试样的固有强度.裂纹愈合的机制主要归结于退火过程中残余应力的驰豫导致扩散键合和裂纹表面碳化硅颗粒的氧化作用.然而,过度的氧化会降低裂纹愈合的效果.
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