研究了颗粒增强铝基复合材料ZL101A/SiCp/20p的电子束焊接工艺.研究表明,直接采用电子束焊焊接该类材料,难以获得焊缝成形.采用富Si非增强中间层,通过熔化中间层间接熔化两侧SiCp/Al,得到了较理想的焊缝成形.为获得良好焊缝成形,应合理选取中间层厚度、焊接速度和焊接电流及聚焦方式.采用非增强中间层电子束焊接气孔问题较突出.气孔主要发生于部分熔化的热影响区,快速焊接能使气孔形成受到部分抑制.
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