研究了玻璃粘结剂组成和含量对陶瓷电容器镍电极附着力、方阻和可焊性的影响,并使用SEM和EDS分析了其中的影响机制.结果表明,ZnO和PbO能够提高玻璃对陶瓷基板的润湿性能,进而增强镍电极的附着强度;增大玻璃含量有助于增强镍电极的附着强度,但在晶界和镍晶粒内部析出的多余玻璃相会导致电极电性能和可焊性下降.镍导电浆料中玻璃与镍粉质量比为0.08是比较合适的.
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