从5种不导电的材料中筛选出化学镀效果最佳的材料作为基体,通过SEM,EDX对比该基体与细胞的表面镀层,最终通过测量所选基体表面镀层的电阻率间接研究7种用于微生物细胞金属化的镀层的导电性.结果表明:所选基体和细胞的表面镀层组成和成分基本一致;7种镀层中含Cu量达100%的镀层导电能力最强,含Ni 76.08 %,Fe 15.53 %,P 8.38%(原子分数)的NiFeP镀层导电能力最差,4种含Cu的镀层中,随含Cu量增加导电能力增强,但并非线性相关.
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