采用以碳化硅为主相的焊料,在无压的条件下,连接氮化硅结合碳化硅陶瓷.结果表明:焊料在室温到1323K的干燥和烧结过程中,体积稳定,稍有膨胀.在1173K保温3h的条件下,连接的样品拉伸强度达到1.76MPa,热震残余强度保持率为82%.接头致密,并且焊料层与母材显微结构非常相似,界面处有明显的元素扩散,这对于提高结合强度和热震性能有重要作用.
参考文献
[1] | 潘裕柏;江东亮.陶瓷连接技术进展[J].硅酸盐通报,1989(06):32-49. |
[2] | Jian Chen;Pan Wei .The wettability of Y-Al-Si-O-N oxynitride glasses and its application in silicon nitride joining[J].Journal of the European Ceramic Society,2000(14/15):2685-2689. |
[3] | XIE Rong-jun;HUANG Li-ping;CHEN Yuan et al.Effects of chemical compositions of adhesive and joining processes on bond strength of Si3N4/Si3N4 joints[J].Ceramics International,1999,25:101-105. |
[4] | Mani Gopal;L.C.De Jonghe;G.Thomas .Silicon nitride: from sintering to joining[J].Acta materialia,1998(7):2401-2405. |
[5] | S.J.Glass;F.M.Mahoney;B.Quillan .Refractory oxynitride joints in silicon nitride[J].Acta materialia,1998(7):2393-2399. |
[6] | WELDON L M;HAMPSHIRE S;POMEROY M J .Joining of ceramics using oxide and oxynitride glasses in the Y-sialon system[J].Journal of the European Ceramic Society,1997,17:1941-1947. |
[7] | STATHIS D;PETEVES .Joining nitride ceramics[J].Ceramics International,1996,22:527-533. |
[8] | 张俊计,刘学建,孙兴伟,蒲锡鹏,黄莉萍.氮化硅基陶瓷连接技术的研究进展[J].陶瓷学报,2002(02):130-133. |
[9] | 王维邦.耐火材料工艺学[M].北京:冶金工业出版社,1996:205-208. |
[10] | 梁训裕.磷酸盐结合的高铝耐火材料[J].国外耐火材料,1998(10):16-19. |
[11] | HORN W F;HUMMEL F A;CENT .Notes on system Al2O3-SiO2-P2O5[J].Glass Ceram Res Inst Bull,1997,16(1-4):47-59. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%