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通过外加法向Sn-3.5Ag钎料中加入质量分数为1%,2%和3%的纳米级多面齐聚倍半硅氧烷(polyhedral oligomeric silsesquioxanes,POSS)颗粒制备无铅复合钎料.系统研究POSS颗粒的显微组织,钎料的熔化特性、润湿性能和力学性能.结果表明:POSS颗粒的加入并没有改变Sn-Ag基复合钎料熔化温度.复合钎料的铺展面积均有所增加,润湿角有所下降,表现了良好的润湿性.POSS颗粒的加入显著提高钎料钎焊接头的剪切强度.

参考文献

[1] 胡志田,徐道荣.无铅软钎料的研究现状与展望[J].电子工艺技术,2005(03):125-128,133.
[2] Fu Guo .Composite lead-free electronic solders[J].Journal of Materials Science. Materials in Electronics,2007(1/3):129-145.
[3] 吴京洧,杨建国,方洪渊.复合钎料的特点及研究现状[J].焊接,2002(12):10-14.
[4] 郭康富,康慧,曲平.无铅钎料开发研究现状[J].电子元件与材料,2006(02):1-3,7.
[5] SHAWN H PHILLIPS;TIMOTHY S HADDAD;SANDRA J TOMCZAK .Developments in nanoscience:polyhedral oligomeric silsesquioxane (POSS)-polymers[J].Solid State and Materials Science,2004,8(01):21-29.
[6] LI Gui-zhi;WANG Li-chang;NI Han-li et al.Polyhedral oligomeric silsesquioxane (POSS) polymers and copolymers:a review[J].Journal of Inorganic and Organometallic Polymers,2001,11(03):123-154.
[7] ANDRE LEE;K.N.SUBRAMANIAN .Development of Nano-Composite Lead-Free Electronic Solders[J].Journal of Electronic Materials,2005(11):1399-1407.
[8] Erin Shammel Baker;Jennifer Gidden;David P. Fee;Paul R. Kemper;Stanley E. Anderson;Michael T. Bowers .3-Dimensional structural characterization of cationized polyhedral oligomeric silsesquioxanes (POSS) with styryl and phenylethyl capping agents[J].International journal of mass spectrometry,2003(1):205-216.
[9] Fina A;Tabuani D;Frache A;Camino G .Polypropylene-polyhedral oligomeric silsesquioxanes (POSS) nanocomposites[J].Polymer: The International Journal for the Science and Technology of Polymers,2005(19):7855-7866.
[10] HUANG B;NING-CHEN LEE.Prospect of lead free alternativesfor reflow soldering[A].USA:SPIE-Int Soc Opt Eng,1999:711-721.
[11] 王从曾;刘会亭.材料性能学[M].北京:北京工业大学出版社,2004:51-55.
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