应用差示扫描量热(DSC)法、润湿平衡分析技术和拉伸试验,研究了Sn-XAg-0.5Cu (X=0.1～3.0)无铅钎料合金的熔化特性、润湿性能及力学性能.实验结果表明:所有钎料合金的开始熔化温度均为217.3℃;随合金中Ag含量增加,熔化温度区间变窄.钎料的润湿铺展面积和润湿力随Ag含量的增加而先显著增加,而后趋于稳定;对润湿铺展面积和润湿力(或润湿时间)产生显著影响的阈值Ag含量为1.0%( 质量分数,下同).Ag含量在0.5%～3.0%时,随着Ag含量的增加,钎料的断后伸长率逐渐下降,而抗拉强度和0.2%屈服强度均逐渐增加.
参考文献
| [1] | MOON K W;BOETTINGER W J .Accurately determining eutectic compositions:The Sn-Ag-Cu ternary eutectic[J].JOM-Journal of the Minerals Metals and Materials Society,2004,56(04):22-27. |
| [2] | Kim KS.;Huh SH.;Suganuma K. .Effects of cooling speed on microstructure and tensile properties of Sn-Ag-Cu alloys[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2002(1/2):106-114. |
| [3] | K. S. Kim;S. H. Huh;K. Suganuma .Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2003(1/2):226-236. |
| [4] | SUN-KYOUNG SEO;SUNG K. KANG;DA-YUAN SHIH;HYUCK MO LEE .An Investigation of Microstructure and Microhardness of Sn-Cu and Sn-Ag Solders as Functions of Alloy Composition and Cooling Rate[J].Journal of Electronic Materials,2009(2):257-265. |
| [5] | HUANN-WU CHIANG;KENNDY CHANG;JUN-YUAN CHEN .The Effect of Ag Content on the Formation of Ag_3Sn Plates in Sn-Ag-Cu Lead-Free Solder[J].Journal of Electronic Materials,2006(12):2074-2080. |
| [6] | Henry Y. Lu;Haluk Balkan;K.Y. Simon Ng .Microstructure evolution of the Sn-Ag-y%Cu interconnect[J].Microelectronics and reliability,2006(7):1058-1070. |
| [7] | Seok-Hwan Huh;Keun-Soo Kim;Katsuaki Suganuma .Effect of Ag Addition on the Microstructural and Mechanical Properties of Sn-Cu Eutectic Solder[J].Materials transactions,2001(5):739-744. |
| [8] | M. Reid;J. Punch;M. Collins;C. Ryan .Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys[J].Soldering & Surface Mount Technology,2008(4):3-8. |
| [9] | Jong-Hyun Lee;A-Mi Yu;Jeong-Han Kim .Reaction Properties and Interfacial Intermetallics for Sn-xAg-0.5Cu Solders as a Function of Ag Content[J].METALS AND MATERIALS International,2008(5):649-654. |
| [10] | Lu HY;Balkan H;Ng KYS .Effect of Ag content on the microstructure development of Sn-Ag-Cu interconnects[J].Journal of Materials Science. Materials in Electronics,2006(3):171-188. |
| [11] | A-Mi Yu;Chang-Woo Lee;Mok-Soon Kim .The Effect of the Addition of In on the Reaction and Mechanical Properties of Sn-1.0Ag-0.5Cu Solder Alloy[J].Metals and Materials International,2007(6):517-520. |
| [12] | LIN K S;HUANG H Y;CHOU C P .Interfacial reaction between Sn-1Ag-0.5Cu(Co) solder and Cu substrate with Au/Ni surface finish during reflow reaction[J].Journal of Alloys and Compounds,2009,471(1-2):291-295. |
| [13] | LI Guo-yuan,SHI Xun-qing.Effects of bismuth on growth of intermetallic compounds in Sn-Ag-Cu Pb-free solder joints[J].中国有色金属学会会刊（英文版）,2006(z1):739-743. |
| [14] | SUH D W;KIM D W;LIU P L et al.Effects of Ag content on fracture resistance of Sn-Ag-Cu lead-free solders under high-strain rate conditions[J].Materials Science and Engineering A,2007,460-461(1-2):596-603. |
| [15] | K. S. Lin;H. Y. Huang;C. P. Chou .Interfacial Reactions and Bonding Strength of Sn-xAg-0.5Cu/Ni BGA Solder Joints[J].Journal of Materials Engineering and Performance,2009(2):182-189. |
上一张
下一张
上一张
下一张
计量
- 下载量(0)
- 访问量(148)
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%